Adhesives
Base Materials provide filled and unfilled systems in a range of working times. Once cured, the product achieves exceptional mechanical and thermal characteristics. The specially formulated adhesives are perfectly suited for the bonding of epoxy and polyurethane tooling boards.
| Product |
Typical Applications |
Features and Benefits |
| BB551 rapid setting low viscosity adhesive |
Consists of a two part component, rapid setting, low viscosity, epoxy system designed for use in medium to high temperature applications. |
System gels at room temperature. Requires a post cure to achieve maximum properties. |
| BB570 density adhesive |
Consists of a two component epoxy system designed for use where a matched density is required when using BB978 and BB769 epoxy tooling boards. It can also be used in many other bonding applications. |
The paste application gives an open time, ideal for large blocking requirements. System gels at room temperature. Requires a post cure to achieve maximum properties. |
| BB580 toughened epoxy system |
A two component toughened epoxy system designed for use where thermal and/or mechanical cycling is likely to occur. |
The mixed viscosity of BB580 allows for very thin bond lines. |
| BB590 high temperature adhesive |
Designed for use in high temperature applications, giving excellent impact performance. |
Non thixotropic, giving very thin bond lines. |
Repair Paste
The repair paste we supply has been specifically formulated to allow the repair of small holes and imperfections created by machining and/or handling.
The product is quick and easy to work with, curing in 5 minutes at ambient temperature, then able to be sanded to required finish.
| Product |
Applications |
Benefits |
| BB879 Rapid Setting Repair Paste |
Rapid setting repair paste is designed for use with epoxy tooling boards. |
Easy to work with Five minute curing time at ambient temperature |
This email address is being protected from spambots. You need JavaScript enabled to view it. to discuss your project requirements.