Base Materials provide filled and unfilled systems in a range of working times. Once cured, the product achieves exceptional mechanical and thermal characteristics. The specially formulated adhesives are perfectly suited for the bonding of epoxy and polyurethane tooling boards.
||Features and Benefits
|BB551 rapid setting low viscosity adhesive
||Consists of a two part component, rapid setting, low viscosity, epoxy system designed for use in medium to high temperature applications.
||System gels at room temperature. Requires a post cure to achieve maximum properties.
|BB570 density adhesive
||Consists of a two component epoxy system designed for use where a matched density is required when using BB978 and BB769 epoxy tooling boards. It can also be used in many other bonding applications.
||The paste application gives an open time, ideal for large blocking requirements. System gels at room temperature. Requires a post cure to achieve maximum properties.
|BB580 toughened epoxy system
||A two component toughened epoxy system designed for use where thermal and/or mechanical cycling is likely to occur.
||The mixed viscosity of BB580 allows for very thin bond lines.
|BB590 high temperature adhesive
||Designed for use in high temperature applications, giving excellent impact performance.
||Non thixotropic, giving very thin bond lines.
The repair paste we supply has been specifically formulated to allow the repair of small holes and imperfections created by machining and/or handling.
The product is quick and easy to work with, curing in 5 minutes at ambient temperature, then able to be sanded to required finish.
|BB879 Rapid Setting Repair Paste
||Rapid setting repair paste is designed for use with epoxy tooling boards.
||Easy to work with
Five minute curing time at ambient temperature